shield can
Model: YK585
Applications
Description
The YK585 shielding cover is a precision stamped and formed electromagnetic shielding component. It utilizes a high conductivity metal substrate with a tinned surface treatment, integrates arrayed heat dissipation holes and a bent buckle structure, and possesses excellent electromagnetic shielding efficiency, good heat dissipation, and convenient assembly. It can effectively suppress electromagnetic interference between PCB circuits, isolate signal crosstalk, and is widely used in circuit board shielding protection scenarios in fields such as communication equipment, industrial control, and consumer electronics.
Features
- Highly conductive substrate + tin plating process, excellent electromagnetic shielding performance, effectively suppressing EMI/RFI interference
- The arrayed heat dissipation hole design balances shielding performance and heat dissipation requirements, preventing equipment overheating
- The bent buckle structure allows for quick assembly without welding, reducing production and installation costs
- Precision stamping and forming ensure high dimensional consistency, good fit with PCB boards, and stable grounding contact
- Tin plating surface treatment, oxidation and corrosion resistance, excellent solderability, compatible with reflow soldering process
- The compact design of the octagonal shape fits into narrow PCB installation spaces, without occupying additional layout area
Specifications
Whitepapers
Features
- Highly conductive substrate + tin plating process, excellent electromagnetic shielding performance, effectively suppressing EMI/RFI interference
- The arrayed heat dissipation hole design balances shielding performance and heat dissipation requirements, preventing equipment overheating
- The bent buckle structure allows for quick assembly without welding, reducing production and installation costs
- Precision stamping and forming ensure high dimensional consistency, good fit with PCB boards, and stable grounding contact
- Tin plating surface treatment, oxidation and corrosion resistance, excellent solderability, compatible with reflow soldering process
- The compact design of the octagonal shape fits into narrow PCB installation spaces, without occupying additional layout area
Specifications
shield can
Model: YK585
Applications
Description
The YK585 shielding cover is a precision stamped and formed electromagnetic shielding component. It utilizes a high conductivity metal substrate with a tinned surface treatment, integrates arrayed heat dissipation holes and a bent buckle structure, and possesses excellent electromagnetic shielding efficiency, good heat dissipation, and convenient assembly. It can effectively suppress electromagnetic interference between PCB circuits, isolate signal crosstalk, and is widely used in circuit board shielding protection scenarios in fields such as communication equipment, industrial control, and consumer electronics.
Whitepapers
Related Cases
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The onboard domain controller and radar module of intelligent driving solution providers are prone to electromagnetic interference due to their internal circuits, poor chip heat dissipation, and inadequate antenna protection, leading to unstable AI perception data. Our company customizes integrated shielding covers, heat dissipation covers, and antenna covers that combine electromagnetic isolation, thermal conduction and dissipation, and antenna protection. These products have passed AEC-Q automotive testing, ensuring pure radar and domain controller signals and stable support for AI multi-sensor fusion operations. They are now available for bulk supply to designated customers.
某智能汽车企业
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某国家级高新技术企业